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Product category: Temperature measurement: IR techniques
News Release from: Armstrong Optical | Subject: IR112
Edited by the Processingtalk Editorial Team on 24 August 2005

40% more pixels for thermal sensor
module range

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Similar in size to the IR108 thermal sensor modules, the new IR112 thermal sensor module offers users the ability to use 40% more pixels for 8 to 14 micron infrared imaging applications

The new IR112 thermal sensor module from Armstrong Optical of Northampton offers users the ability to use 40% more pixels for 8 to 14 micron infrared imaging applications Based around a 384 x 288 pixel array of 35micron square pixels fabricated from amorphous silicon, the uncooled microbolometer array has been designed for easy integration into 3rd party thermal imaging camera systems

Once again the sensor array module is truly plug-n-play with standard video output (PAL/NTSC) complimented by built-in FireWire 1394; gain, offset, zoom, brightness, contrast and image display are all available through standard interfaces increasing the versatility of this thermal sensor module.

The IR112 represents the latest of the new thermal imaging products available from Armstrong Optical - including a fully radiometric system the size of a mobile phone (the MobIR M4) and a new top-of-the-range hand-held system for predictive/preventive maintenance applications (the IR928+).

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