MAZeT presents first "Lead-free" PCB cards

With its group of components for mobile embedded computing applications, MAZeT presents a development in parts based entirely on "lead-free" components and production

With its group of components for mobile embedded computing applications, MAZeT, the leading company for electronic developments, ASICs and sensors, presents a development in parts based entirely on "lead-free" components and production.

This client-specific development displays MAZeT know-how one year before the introduction of rules regarding RoHS compliance (RoHS: Restriction of the Use of Certain Hazardous Substances in Electric and Electronic Equipment).

With extensive in-house tests and highly intensive and well-adapted co-operation with the supplier company, MAZeT has defined the necessary logistical process providing the definitive conditions for lead-free production.

Continuous and targeted work on the choice of components and the constructive composition of the components has enabled MAZeT at the end of the development phase to present an RoHS- compliant group of components meeting all the specifications.

During 2005 MAZeT will replace all parts and components containing lead in its development and production of printed circuit boards to make them RoHS-compliant, wherever requested by the client.

With the support of long-term partnerships, MAZeT is in a position to ensure the reliability of the parts.

MAZeT has comprehensively mastered the processes for the development of RoHS-compliant components and the lead-free soldering process.

The design house is also in a position to carry out repairs on lead-free components.

The soldering process for SMD components will take place in a vapour phase solder facility with lead-free solder.

The available process documentation ensures that high quality is maintained throughout the soldering process.

Later checks ensure the supply of electronic components that not only meet their specifications but that are also of a high quality.

In recent months MAZeT has worked intensively in co-operation with the suppliers to meet the conditions specified in guidelines 2002/95/EG ("RoHS Guidelines").

These guidelines set out threshold values for the heavy metals lead (Pb), mercury (Hg), cadmium (Cd), hexavalent chromium (Cr-6) as well as polychlorinated biphenyls (PCB) and polybromated diphenylether (PBDE), which are used as flame retardants, that must not be exceeded in the components or in the complete parts used.

"In connection with the change to RoHS-compliant components, many individual components are abandoned as having no alternatives, which leads to a re-work of the group of components or a complete re- design," explains Dr Fred Grunert, managing director of MAZeT.

"We have used our experience and competence in this matter and support the affected companies with this re-work or re-design of electronic components in order to reach RoHS-compliance.".

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