Product category:
Packaging, Conveyors and Materials Transfer
News Release from: OMAC | Subject: Pack Expo 07
Edited by the Processingtalk Editorial
Team on 19 September 2007
OMAC packaging hosts demo at Pack Expo
2007
The OMAC Packaging Workgroup (OPW) will host a demonstration of its guidelines at Pack Expo 2007, to be held from 15-17 October at the Las Vegas Convention Centre
The OPW Booth, number C-953 in the Association Pavilion, will highlight the "Benefits of Packaging Line Integration" Nine companies will be participating with demonstrations of controller, HMI, and MES functionality using the OPW Connect-and-Pack Guidelines: Acumence, B+R, Beckhoff, Elau, GE Fanuc, Iconics, Kepware, Siemens, and Wago
This article was originally published on Processingtalk on 10 Oct 2008 at 8.00am (UK)
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All of the demonstration units will be integrated together using OPC over Ethernet.
Seven of the companies (B+R, Beckhoff, Elau, GE Fanuc, Kepware, Siemens and Wago) will be implementing the OPW PackML State Model on their controllers.
B+R, GE Fanuc, Iconics and Siemens will be implementing the PackML State Model on their respective HMI.
PackTags will allow any HMI application to be able to display and control the state model of any of the controllers.
Three companies (Acumence, Iconics and Siemens) will be implementing MES functionality using PackML.
These MES applications will be able to connect to any of the controllers through PackTags, calculate OEE, and pareto chart the times in the states of the PackML state model.
The OMAC Packaging Workgroup will also host a User Meeting on Tuesday, October 16, at 2pm in Room S-232 in the South Hall of the Las Vegas Convention Centre.
The purpose of the meeting is to present an overview of the OPW Connect-and-Pack Guidelines and their benefits to users, OEMs, and technology providers.
During the meeting, Rick VanDyke, Group Manager Controls and MES Systems at Frito Lay, will discuss how OPW Guidelines support "Transforming Manufacturing Packaging System Performance".
On Wednesday, October 17, the PackML Group of the OMAC Packaging Workgroup will host a meeting at 2pm in Room S-225 in the South Hall of the Las Vegas Convention Centre.
The purpose of the meeting is to update attendees on the progress of incorporating PackML into the ISA88 Part 5 (Make2Pack) standard.
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