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News Release from: OMAC | Subject: OMAC seminar
Edited by the Processingtalk Editorial
Team on 20 November 2007
OMAC symposium finalises programme
The first Annual OMAC Integration and Operability Symposium will take place 28-29 November at the Boeing Future of Flight Aviation Centre and the Hilton Garden in Everett, Washington
The theme of the symposium is "Bridging the Gap between the Discrete and Process Industries" through improving integration by leveraging best practices and lessons learned, with integration through standards like those for CAM and CNC control, inspection, CAD definition, data packaging, process planning, and the automotive industry Attendees will work together to establish a collaboration and integration roadmap, creating a forum enabling better collaboration between the process and discrete industries via the OMAC Working Group
This article was originally published on Processingtalk on 6 Jun 2007 at 8.00am (UK)
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The first OMAC technical symposium is in November
The OMAC leadership team is currently developing the framework for the first annual OMAC technical symposium, to be held 28-29 November, hosted by Boeing in USA
Pack Expo 2007 demonstration participants
The OMAC Packaging Workgroup (OPW) will be showcasing the "Benefits of Packaging Line Integration" in their booth at Pack Expo 2007, with demos from 9 companies
Event highlights include Working Group meetings, a tour of the Boeing 787 Dreamliner Manufacturing Facility, case studies and presentations, breakout sessions, a social event for networking, and more.
The presentations for the symposium have been finalized and will contain presentations with titles like ""CNC-ERP Connectivity - Top Floor to Shop Floor", "ISA 88 Part 5: Modular Concepts for Automated Systems", "Enabling and Deploying Operational Performance", "Global Strategy and Scalable Architectures", "Training, Opening the Door behind the Door", "OMAC to THINC to Factory (The Red Queen Inference)", "Swimming Upstream with Your Friends, Enabling and Implementing Open Standards for Manufacturing", "PLM / MES Integration -Closing the Loop from As-built to As-Designed", "On the Road to OMAC HMI Best Practices", and "Best Practices and Applications in Manufacturing IT".
Presenters include Sid Venkatesh, Isaac K Opoku , Robert Maki, and David Odendahl, the Boeing Company; Dan Seger, Rockwell Automation; Rob Aleksa, Procter and Gamble; Jerry Yen, General Motors CCRW Group; Robert Hampton, Hampton Leadership Development; Bob Tain, Okuma; Dick Slanski and Al Bissmeyer, ARC Advisory Group; John Michaloski, National Institute of Standards and Technology (NIST); and Erik Goode, Cargill.
Visit the OMAC Symposium website to read descriptions of these presentations, to view a PDF of the event programme, and to register.
Registration is limited to 150 attendees, and is on a first come, first served basis.
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