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OMAC training session at Packaging Automation

An OMAC product story
Edited by the Processingtalk editorial team Feb 25, 2008

At the Packaging Automation Forum, in Chicago, May 2008, OMAC will provide a half day training session for attendees, describing Make2Pack and Connect-and-Pack

The session will be broken up into a Make2Pack workshop and a Hands-on Connect-and-Pack demonstration.

Dave Chappell, Chairman of Make2Pack and former corporate technical section head at Procter and Gamble, will serve as the Workshop Facilitator for the Make2Pack workshop, scheduled to take place from 1pm to 3pm.

Workshop attendees will learn the "intent" of the Make2Pack standards that will be used by industry to develop and support factory floor automation.

As these new standards gain acceptance, they will impact and improve manufacturing operations.

This educational session will better prepare attendees to benefit from these evolving changes.

As the Workshop Facilitator, Chappell will share his comprehensive knowledge of Make2Pack standards in an optimum learning environment.

Workshop goals include providing attendees a better understanding of the intent and purpose of the standards, helping attendees better understand how the standards can affect and benefit their operations, and sharing insight on and details about implementation of the standards.

The hands-on Connect-and-Pack Demonstration will take place from 3pm to 5pm, following a brief overview of the Connect-and-Pack Demonstration.

OPW (the OMAC Packaging Workgroup) will provide this "hands-on" session intended to educate and inform the packaging community about the ease of integrating various packaging line functions (control, HMI, MES) using the OPW Connect-and-Pack guidelines.

The Connect-and-Pack guidelines make packaging operations more effective by simplifying customisation and integration, enabling world class packaging operations.

When properly implemented, these guidelines aid packaging companies and their partners in optimising operations as they gain a competitive advantage by leveraging an integrated supply chain.

During the hands-on session, attendees will be afforded the opportunity to see how the participating technology providers will be implementing one or more of the packaging line functions (control, HMI, MES) utilising the Connect-and-Pack guidelines.

Each technology provider will show: * How PackML and PackTags are implemented on their system.

* How OPC is configured to enable PackTags to be communicated to other demo applications (control, HMI, MES).

* What documentation is provided for aiding in implementation of the Connect-and-Pack guidelines.

* What templates are provided for simplifying the configuration of a Connect-and-Pack application.

The Packaging Automation Forum will take place from 19-20 May 2008, at the Chicago Marriott Schaumburg: OMAC will provide the half day training session for attendees on Monday, 19 May, starting at 1pm.

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