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Product category: Condition monitoring and vibration analysis
News Release from: Polytec | Subject: Measurement Services Programme
Edited by the Processingtalk Editorial Team on 30 January 2007

Vibration and topography measurement
services

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The Polytec new Measurement Services Programme makes advanced non-contact vibration and topography measurements available for every budget

Polytec, the global expert in optical measurement systems for macro and microstructure vibration testing, announces a new Measurement Services Programme that makes advanced non-contact vibration and topography measurements available for every budget The innovative programme provides engineers with measurement results using the latest Polytec non-contact measurement technology and, if needed, the expert advice and skill of a Polytec applications engineer

By eliminating the need for a capital purchase and/or the addition of dedicated manpower, the new Measurement Services Programme gets precision results in the hands of engineers who have short-notice critical needs, require occasional measurements where a purchase is not justified, wish to evaluate Polytec products prior to purchase or prefer to contract a service.

Using the programme, test structures are characterised with state-of-the-art equipment such as 1-D and 3-D scanning laser vibrometers, single-point vibrometers, microstructure (MEMS) motion analysers and topography measurement systems, operated by knowledgeable and experienced application engineers.

The measurement technology is fundamentally nondestructive, works on most surface finishes, eliminates mass-loading, improves data accuracy and minimises contact transducer mounting, wiring, and signal conditioning.

Vibrometer systems characterise virtually anything that vibrates up to 30 m/s or 30 MHz, down to picometer resolution.

Tests may be run at the customer facility or in one of three Polytec labs in North America: Detroit, Los Angeles and Boston.

Complete measurement results are provided to the customer and may include frequency response functions, operational deflection shapes, time and frequency domain response, 3-D motion vectors, in-plane and out-of-plane MEMS dynamics, structure geometry and surface topography.

Data can be exported in several formats for further processing such as FE correlation and modal analysis.

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