X-ray fluorescence to measure surface layers

The MicroXR microbeam XRF platform is designed for on-line and near-line measurements on semiconductor wafers, optical devices, high-density chip-scale packaging and substrate applications

Thermo Electron Corporation announces the release of its latest X-ray fluorescence instrument for semiconductor metrology, the MicroXR microbeam XRF platform.

Designed for on-line and near-line measurements on semiconductor wafers, optical devices, high-density chip-scale packaging and substrate applications, the MicroXR presents particular benefits for the semiconductor and microelectronics markets.

The MicroXR uses a unique combination of microbeam X-ray collimation technology and traditional energy dispersive XRF (EDXRF) spectroscopy.

The end result is a non-destructive metrology technique that measures the thickness and composition of up to five layers of deposited metals simultaneously.

Metal film thickness ranges from micron to angstrom levels.

The new XRF platform can also determine bulk alloy composition for up to 20 elements.

The use of optically collimated X-rays delivers intensity gains of up to 1000 times over traditional XRF tools.

X-rays generated by a 50W X-ray tube are redirected and focused on the sample surface.

The resulting intensity on the sample surface is equivalent to the intensity generated by a 50kW X-ray tube.

Solid state detector technology, which operates without liquid nitrogen cooling, in combination with digital pulse processing, guarantees high count rate throughput performance This technology dramatically reduces measurement time while greatly increasing accuracy, precision and reproducibility - making the MicroXR platform principally suited for high volume, high density manufacturing environments.

The MicroXR series is available in benchtop, console, and automated wafer handling configurations.

The console and wafer handler models incorporate an embedded vibration isolation system and are compatible with most wafer sizes (150, 200 and 300 mm).

The platform can be configured with different types of optical collimators and X-ray detectors.

Patented Vacuum Conduit technology provides near vacuum measurement performance while leaving the sample under atmosphere, a unique feature that enables the measurements of elements down to aluminum.

The wafer handler configuration includes the MicroXR console system and an automated equipment front-end module (EFEM).

It is Class 1 cleanroom ready, and compliant with CE and SEMI S2 and S8 requirements.

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