Economic range of liquid thermal shock chambers

An Unitemp product story
Edited by the Processingtalk editorial team Mar 30, 2007

Unitemp announce a new range of liquid to liquid thermal shock chambers, ideal for semiconductor testing, and also for electronic, electrical, automotive components and small sub-assemblies

Unitemp announce the availability of a new range of liquid to liquid thermal shock chambers.

Although ideal for semiconductor testing, the range also be used with electronic, electrical, automotive components and small sub-assemblies.

The chambers cater for the diverse requirements of Laboratories, Research facilities and Industry.

Designated the TSB series from ESPEC, they are constructed inside and out from top quality stainless steel.

The hotbath temperature range is from 70 to 200 degrees C whilst the cold bath temperature range is -65 to 0 degrees C.

The innovative TSB range reduces the problem of continual loss fo expensive testing fluids by several methods.

One of these is enhanced airtightness, preventing the leakage of evaporated thermal fluid from the test area.

Another is a fan that draws air to a condensing coil that turns evaporated fluid into a liquid, returning it to the baths.

A refrigerated cooling ring at the top of the hot bath helps to limit evaporative losses.

All units incorporate a separation filter for removing water from the thermal fluid.

Using a new ozone friendly HFC refrigeration circuit that reduces energy consumption, saves space and reduces weight.

Improvements in the refrigeration design have reduced power consumption by 52%, and noise levels to as low as 61dB.

The refrigeration change also reduces the chamber footprints by more than 15%.

The SCP-220TS touch screen programmable controller comes with an intuitive screen interface that makes set up programming and test monitoring simple.

Expanded interface options allow chamber communication and control from an external PC.

Liquid to liquid thermal shock is typically conducted to apply very strong, repetitive thermal stress to test pieces.

It can model a product ability to withstand thermally induced size changes, crack resistance, hermetic integrity, and changes in electrical properties.

This form of testing provides a very rapid temperature shock recovery of conditions, and can significantly reduce testing time by requiring shorter soaks and less cycles.

These high quality chambers complement the extensive Unitemp range of test and monitoring chambers / ovens, and they have the expertise to provide 'specials' to customers requirements.

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